Effective Laser Diode Heat Dissipation requires an optimized thermal path from the junction to the external environment. Each interface introduces thermal resistance. Laser Diode Thermal Management describes the controlled removal of heat generated during laser operation. High power laser diodes convert electrical energy into light with a typical efficiency between 10 percent and 50 percent. Therefore, heat dissipation is a. The Transistor Outline package (or TO-Can) was developed to create a highly reliable (often hermetically sealed) package with a very low thermal resistance (impedance), standardized to keep costs down and for universal integration in accordance with JEDEC (Joint Electron Device Engineering. The high-power laser diode (HPLD) has witnessed increasing application in space, as the aerospace industry is developing rapidly. To cope with the space environment, optimizing the heat-dissipation structure and improving the heat-dissipation ability via heat conduction have become key to. This study is focused to review the recent advancements of laser diode and its temperature control mechanisms that include thermoelectric cooler, spray cooling methods, micro-channels and micro heat-pipes.